Chip Reliability

  • Badih El-Kareh
  • Lou N. Hutter


This chapter focuses on component reliability. It begins with an overview of basic reliability concepts and models with emphasis on their applications to reliability engineering. An overview of important failure mechanisms of components and methods to reduce their impact on chip reliability is then presented. The sections include dielectric reliability, electro and stress migration, hot-carrier reliability, latch-up, bias-temperature instabilities, Joule heating and resistor reliability, high-voltage and high-power MOSFET reliability, plasma damage, and electrostatic discharge.

Supplementary material


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Authors and Affiliations

  • Badih El-Kareh
    • 1
  • Lou N. Hutter
    • 2
  1. 1.PIYECedar ParkUSA
  2. 2.Lou Hutter ConsultingDallasUSA

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