Sub-rapid Solidification Study by Using Droplet Solidification Technique
Droplet solidification technique is important with respect to the fundamental study of strip casting given the common conditions of direct contact between cooling mold and solidifying metal. In this study, an improved droplet solidification technique has been developed for the in situ observation of the sub-rapid solidification phenomena of metal droplets impinging onto the water-cooled copper substrate. The heat transfer rates were calculated by the inverse heat conduction program (IHCP), according to the responding temperatures’ gradient inside the cooling mold. Meanwhile a charge coupled device (CCD) camera was placed beside the bell jar aimed to record the whole melting and solidification process of the steel sample, which also allowed the determination of the final wetting angel, during the dipping tests. Moreover, it was found that the heat transfer rate increased with decreasing final contact angle, which means better wetting condition between the liquid sample and the copper substrate.
KeywordsDroplet solidification technique Sub-rapid solidification In situ observation
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