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Fabrication and Packaging of Downhole Instruments

  • Chinthaka P. Gooneratne
  • Bodong Li
  • Max Deffenbaugh
  • Timothy Moellendick
Chapter
Part of the Smart Sensors, Measurement and Instrumentation book series (SSMI, volume 32)

Abstract

This chapter provides an overview of the fabrication and packaging methods for downhole environments. Operation in harsh and critical environments requires instruments to meet stringent safety standards. Therefore, all layers of a downhole instrument, such as electronic circuits, components, integrated circuit modules along with encapsulation and packaging, are carefully designed, planned and tested for safe and optimal operation in a well.

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Copyright information

© Springer Nature Switzerland AG 2019

Authors and Affiliations

  • Chinthaka P. Gooneratne
    • 1
  • Bodong Li
    • 2
  • Max Deffenbaugh
    • 3
  • Timothy Moellendick
    • 4
  1. 1.Drilling Technology DivisionEXPEC ARCDhahranSaudi Arabia
  2. 2.Drilling Technology DivisionEXPEC ARCDhahranSaudi Arabia
  3. 3.Aramco Research CenterHoustonUSA
  4. 4.Drilling Technology DivisionEXPEC ARCDhahranSaudi Arabia

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