A General, Full-Wave Approach for Modeling Signal Lines and Discontinuities in Computer Packages
A full-wave moment-method approach is presented for obtaining the electrical characteristics of the 3D signal line and discontinuity structures typically found in computer packages. Rooftop current elements are used to represent both the surface current on conductors and the polarization current in any dielectric regions that may be present. The approach is applied to the computer module used in the IBM 3090 processor unit. The propagation characteristics of signal lines and vias, and coupled noise between signal lines are calculated and compared to results obtained from scale models and specifically designed test vehicles. The approach is then applied to representative, non-TEM waveguide structures that may appear in other package-related environments.
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