Dielectric Breakdown of SiO2 Grown on Rough Si Surfaces
SiO2 grown on CC12F2 reactive ion etched Si has very low breakdown fields, due to reactive ion etching (RIE)-induced surface roughness. Oxidation of the rough Si surface results in a rough Si-SiO2 interface and a rough SiO2 surface. The low breakdown fields are due to field enhancement from bumps at the injecting electrode. The sharpness of the bumps, and hence the field enhancement, is greatest at the Si-SiO2 interface. The interface state density, the minority carrier generation lifetime, and the oxide flatband voltage, mobile charge, and hole trapping, are comparable for metal-oxide-semiconductor (MOS) capacitors fabricated on CC12F2-etched Si and on control Si (no RIE).
KeywordsBreakdown Voltage Field Enhancement Mobile Charge Interface State Density Control Oxide
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