Study of Titanium/Polyimide Interface in a Reducing Environment

  • Kabul S. Sengupta
  • Howard K. Birnbaum

Abstract

The system investigated was Au/Cu/Ti/Polyimide. Heat treatment of these films in reducing ambient introduced a host of problems resulting in film failure. SIMS depth profiles were determined for samples annealed in hydrogen (an essential component of forming gas), at different concentrations and temperatures. It was observed that the hydrogen segregates at the diffusion barrier (Ti), and causes delamination under certain conditions. SIMS, Auger, XPS and X-ray diffraction techniques were used to characterize the interface and to locate the delamination plane in the metal/polymer system.

Keywords

Auger Electron Spectroscopy Titanium Layer Auger Electron Spectroscopy Depth Profile Auger Electron Spectroscopy Spectrum Carbonaceous Layer 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 1991

Authors and Affiliations

  • Kabul S. Sengupta
    • 1
  • Howard K. Birnbaum
    • 1
  1. 1.Department of Materials Science and Engineering and Materials Research LaboratoryUniversity of Illinois at Urbana-ChampaignUrbanaUSA

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