An Electrochemical Method of Polyimide Metallization

  • Larry J. Krause
  • Tom A. Speckhard

Abstract

A chemical process for depositing copper films on polyimide substrates is described. The process is dependent upon the reversible electrochemical charge storage of polypyromellitimides in aqueous electrolytes and the reaction of these polymers with aqueous chemical reductants. The process is shown to be continuous, patternable, and produces metal films with high adhesion to the polymer substrate. The adhesion is, however, sensitive to relative humidity. Electrochemical characteristics of chemically and thermally cyclized polyimide are also outlined.

Keywords

Adhesion Strength Copper Film Electroless Copper Thin Copper Film Kapton Film 
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References

  1. 1).
    K.L. Mittal, editor, “Polyimides: Synthesis, Characterization and Applications,” Vols. 1 and 2, Plenum Press, New York, 1984.Google Scholar
  2. 2).
    R.C. Haushalter and L.J. Krause, Thin Solid Films, 102, 161 (1983).CrossRefGoogle Scholar
  3. 3).
    R.C. Haushalter and L.J. Krause, in “Polyimides: Synthesis, Characterization and Applications,” K.L. Mittal, editor, Vol. 2, pp. 735–750, Plenum Press, New York, 1984.Google Scholar
  4. 4).
    S. Mazur and S. Reich, J. Phys. Chem., 90, 1365 (1986).CrossRefGoogle Scholar
  5. 5).
    Larry J. Krause and Jack A. Rider, U.S. Patent Nos. 4,775,556 (1988) and 4, 710, 403 (1987).Google Scholar
  6. 6).
    C.E. Sroog, J. Polym. Sci. Macromol. Rev., 11, 161 (1976).CrossRefGoogle Scholar
  7. 7).
    S. Mazur, P.S. Lugg and C. Yarnitsky, J. Electrochem. Soc, 134, 346 (1987).CrossRefGoogle Scholar
  8. 8).
    A. Viehbeck, C.A. Kovac, S.L. Buchwalter, M.J. Goldberg and S.L. Tisdale, “Metallization of Polymers,” E. Sacher, J.J. Pireaux and S.P. Kowalczyk, editors, ACS, Washington, D.C., 440. chapter 29 (1990).Google Scholar
  9. 9).
    S. Mazur, L.E. Manring, M. Levy, G.T. Dee, S. Reich and C.L. Jackson, in “Metallized Plastics 1: Fundamental and Applied Aspects,” K.L. Mittal and J.R. Susko, editors, Plenum Press, New York, 1989.Google Scholar
  10. 10).
    L.J. Krause and J.L. Bales, J. Electrochem. Soc, 135, 1365 (1988).CrossRefGoogle Scholar
  11. 11).
    L.J. Krause, P.S. Lugg and T.A. Speckhard, J. Electrochem. Soc, 136, 1379 (1989).CrossRefGoogle Scholar
  12. 12).
    R.L. Pecksok and R.S. Juvet, J. Am. Chem. Soc., 75, 1202 (1953).CrossRefGoogle Scholar
  13. 13).
    R.W. Murray, in “Electroanalytical Chemistry, A Series of Advances,” Allen J. Bard, editor, Marcel Dekker Inc., New York, 13, 191 (1984).Google Scholar
  14. 14).
    C.P. Andrieux and J.M. Saveant, J. Electroanal. Chem., 111, 377 (1980).CrossRefGoogle Scholar
  15. 15).
    N.J. Chou and C.H. Tang, J. Vac. Sci. Technol. A2(2), 751 (1984).Google Scholar

Copyright information

© Springer Science+Business Media New York 1991

Authors and Affiliations

  • Larry J. Krause
    • 1
  • Tom A. Speckhard
    • 1
  1. 1.3M Co. Industrial and Electronics Sector LabSt. PaulUSA

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