Advances in Cryogenic Engineering Materials pp 449-456 | Cite as
Computer Simulations of Bi-2223 Sintered Bulk
Chapter
Abstract
Models for Bi-2223 ceramic processing and fracture, which is obtained by hot-pressing, are discussed. Computer simulation was applied to phenomena occurring during sintering, cooling, and following fracture due to the macrocrack growth. The effects of Ag particles dispersed into the Bi-2223 matrix on some strength properties were studied. Finally, a numerical model for the ceramic conductivity investigation is presented, along with some effective characteristics that were discovered.
Keywords
Fracture Toughness Acta Metall Triple Junction Texture Component Cluster Growth
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