Cryopackaging for Real World Products
Wireless products employing high temperature superconductors (HTS) and cryoelectronics are being sold in the commercial and military marketplace. Product requirements for reliability and cost are driving the configuration of the cryopackage. Engineering challenges for vacuüm life, cryocooler reliability, cryoelectronics reliability, and HTS device reliability must be met within cost goals for the products to be viable in the long term. This paper discusses requirements and design approaches for wireless device cryopackaging.
KeywordsHigh Temperature Superconductor Thermal Performance Military Application Heat Leak Power Spectral Density Analysis
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