Thermal analysis in integrated circuits

  • Josep Altet
  • Antonio Rubio
Chapter

Abstract

The goal of this chapter is to present different techniques to obtain temperature maps or temperature waveforms at certain areas or points of an integrated circuit (IC). The data we need to perform this analysis are: description of the physical structure of the IC, thermal properties of the materials from which it is made, placement of the devices that act as heat sources, description of its power consumption waveform and, finally, the thermal conditions of the IC’s surroundings, which will determine what we will call the boundary conditions.

Keywords

IEEE Transaction Heat Source Heat Flow Integrate Circuit Heat Transfer Equation 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.
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Copyright information

© Springer Science+Business Media Dordrecht 2002

Authors and Affiliations

  • Josep Altet
    • 1
  • Antonio Rubio
    • 1
  1. 1.University Politècnia de CatalunyaSpain

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