The last decade of the twentieth century has witnessed an impressive progress in micromachining technology enabling the fabrication of micron-sized devices, which become more prevalent both in commercial applications and in scientific research. These microsystems have had a major impact on many disciplines, e.g. biology, chemistry, medicine, optics, aerospace, mechanical and electrical engineering. This emerging field not only provides miniature transducers for sensing and actuation in a domain that we could not examine in the past but also allows us to venture into a research area in which the surface effects dominate most of the physical phenomena . Fundamental heat-transfer problems posed by the development and processing of advanced Integrated Circuits (ICs) and MicroElectroMechanical Systems (MEMS) are becoming a major consideration in the design and application of these microsystems. The demands on heat removal and temperature control in modern devices, with highly transient thermal loads, require new techniques for providing high cooling rates and uniform temperature distributions. Thus, thorough understanding of the physical mechanisms dominating microscale heat transfer is vital for continuous evolution and progress of microdevices and microsystems.
KeywordsHeat Pipe Thermal Isolation Microsystem Technology Shape Memory Alloy Actuator Microchannel Heat Sink
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