This contribution will concentrate on several aspects of mixed-mode telecommunication design. Currently, a strong focus on single chip realisations of relatively simple wireless standards like Bluetooth can be foreseen. However, integrating RF, mixed signal and digital baseband on a single die will confront the designer with design aspects he did normally not take into account.
KeywordsClock Frequency Guard Ring Current Spike Substrate Noise Decimation Filter
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- 1.J. Fenk, ‘Highly integrated RF-ICs for GSM, DECT, and UMTS Systems, A Status Review and Development Trends’, proc. ESSCIRC’99, pp. 11–14, 1999Google Scholar
- 2.G. Weinberger,‘ The new millennium: Wireless Technologies for a truly Mobile Society’, Digest ISSCC 2000, pp. 11, 2000Google Scholar
- 3.J.P. Tsividis, Operation and Modeling of the MOS transistor, Mc Graw Hill Book Co. New York, 1987Google Scholar
- 4.A.J. Scholten, et.al. Scholten, et.al. ‘A large signalnon-quasi-static MOS model for RF circuit simulation’, IEDM-99, pp. 163–166, 1999Google Scholar
- 5.L.F. Tiemeijer, ‘RF CMOS modeling’, AACD, 1999Google Scholar
- 6.M. van Heijningen, et.al. ‘Modeling of Digital Substrate Noise Generation and Experimental Verification Using a Novel substrate Noise Sensor’, proc. ESSCIRC’99, pp.186–189, 1999 DuisburgGoogle Scholar
- 7.M. Felder, J. Ganger, ‘Analysis of Ground–Bounce Induced Substrate Noise Coupling in a Low Resistive Bulk Epitaxial Process: Design Strategies to Minimize Noise Effects on a Mixed–Signal Chip’, IEEE Trans. Circ. Syst.–II, vol. 46, pp.14–27–1436, 1999Google Scholar
- 8.B. Nauta, G. Hoogzaad, ‘Substrate Bounce in Mixed-Mode CMOS ICs’, AACD’98 DenmarkGoogle Scholar