Thermal Fatigue Reliability Optimisation of Flip Chip Assemblies

  • Bart Vandevelde
  • Eric Beyne
Chapter

Abstract

The thermal cycling life of flip chip assemblies is often limited by solder joint fatigue. The reliability can be increased by a factor 10 using an underfill material. However, the solder joint reliability is still very dependent on the choice of the underfill material. Using thermo-mechanical simulations, based on non linear finite element simulations, the induced inelastic strains in the solder joints are calculated, and give a value for the expected thermal fatigue life. Combing these FE simulations with an optimisation tool, the optimal underfill material is proposed. The optimisation is based on a parameter sensitivity analysis using DOE techniques. The optimal properties for the underfill are a high elastic modulus and a CTE closely matched to the CTE of the solder joint.

Keywords

Solder Joint Thermal Fatigue Inelastic Strain Parameter Sensitivity Analysis Flip Chip 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media Dordrecht 2000

Authors and Affiliations

  • Bart Vandevelde
    • 1
  • Eric Beyne
    • 1
  1. 1.IMECLeuvenBelgium

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