Pressure Requirements for Diffusion Bonding Titanium

  • C. H. Hamilton

Abstract

The requirements of pressure-time combinations for achieving intimate contact between two surfaces to be solid-state bonded are considered. The bond surfaces are assumed to exhibit relatively rough surfaces as a result of prior machining or other surface preparation, and the resultant surface asperities are considered to be removed by creep deformation under pressure during the bonding process. The deformation of both continuous groove-like asperities and local pyramidal-like asperities are considered analytically. The analysis provides a quantitative method for assessing the complex inter-relationships among pressure, bond time, and bonding temperature. Comparison with experimental results demonstrates generally good agreement with the prediction of these parametric combinations.

Keywords

Creep Deformation Bonding Temperature Diffusion Bond Bond Time Bond Line 
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Copyright information

© Springer Science+Business Media New York 1973

Authors and Affiliations

  • C. H. Hamilton
    • 1
  1. 1.Materials and Processes Engineering Los Angeles DivisionNorth American Rockwell CorporationLos AngelesUSA

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