The Strength of Ten Structural Adhesives at Temperatures Down to -424°F

  • W. M. Frost
Conference paper
Part of the Advances in Cryogenic Engineering book series (ACRE, volume 5)

Abstract

The objective of this research was to evaluate several structural adhesives at low temperatures.

Keywords

Adhesive Bond Glass Cloth Structural Adhesive Dicyan Diamide Transient Stress 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

  1. 1.
    Wright Air Development Center, Technical Report 59–152.Google Scholar
  2. 2.
    R. M. McClintock and M. J. Hiza, “Epoxy resins as cryogenic structural adhesives,” Modern Plastics (June, 1958).Google Scholar
  3. 3.
    F. W. Reinhart, et al., Adhesion and Adhesives, Fundamentals and Practice, John Wiley and Sons, Inc., New York (1954).Google Scholar
  4. 4.
    Adhesive Properties, -300 to+700°F (ASTIA Document No. AD151529).Google Scholar

Copyright information

© Springer Science+Business Media New York 1960

Authors and Affiliations

  • W. M. Frost
    • 1
  1. 1.CEL National Bureau of StandardsBoulderUSA

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