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Development of Adhesives for Very Low-Temperature Application

  • M. B. Smith
  • S. E. Susman
Conference paper
Part of the Advances in Cryogenic Engineering book series (ACRE, volume 8)

Abstract

The purpose of this program was to provide an adhesive, or family of adhesives for bonding clips, brackets, etc., to skin portions of cryogenic fuel and oxidizer containers and other related components of launch vehicles for space craft. The adhesives were to be applicable when completely submerged in various cryogens. It was desired that the techniques of surface preparation and bonding be simple and readily adaptable to field use by technicians with little or no experience in plastics technology. It was further desired that the adhesives be suitable for application to vertical, horizontal, or overhead surfaces. Bonding and curing were to be accomplished under ambient conditions with an absolute minimum of bonding pressure—less than 1 psi.

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Copyright information

© Springer Science+Business Media New York 1963

Authors and Affiliations

  • M. B. Smith
    • 1
  • S. E. Susman
    • 1
  1. 1.Division of Telecomputing CorporationNarmco Research and DevelopmentSan DiegoUSA

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