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Numerical Simulation Study on Heat Exchange Effect of Open Computer

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Computer Engineering and Technology (NCCET 2018)

Part of the book series: Communications in Computer and Information Science ((CCIS,volume 994))

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Abstract

This article conducts a thermal simulation analysis of an open computer. Through the simulation results, the module structure and the chassis structure are optimized. And verify the reliability of thermal design of the chassis. It provides reference for thermal simulation analysis and thermal optimization design of other similar electronic devices.

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Author information

Authors and Affiliations

  1. The Computer Department, Jiangsu Automation Research Institute, Lianyungang, China

    Xiangci Meng

Authors
  1. Xiangci Meng
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Corresponding author

Correspondence to Xiangci Meng .

Editor information

Editors and Affiliations

  1. National University of Defense Technology, Changsha, China

    Weixia Xu

  2. National University of Defense Technology, Changsha, China

    Liquan Xiao

  3. National University of Defense Technology, Changsha, China

    Jinwen Li

  4. National University of Defense Technology, Changsha, China

    Zhenzhen Zhu

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Meng, X. (2019). Numerical Simulation Study on Heat Exchange Effect of Open Computer. In: Xu, W., Xiao, L., Li, J., Zhu, Z. (eds) Computer Engineering and Technology. NCCET 2018. Communications in Computer and Information Science, vol 994. Springer, Singapore. https://doi.org/10.1007/978-981-13-5919-4_8

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  • DOI: https://doi.org/10.1007/978-981-13-5919-4_8

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-13-5918-7

  • Online ISBN: 978-981-13-5919-4

  • eBook Packages: Computer ScienceComputer Science (R0)

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