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Second-Order Fluid Through Porous Medium in a Rotating Channel with Hall Current

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Emerging Technologies in Data Mining and Information Security

Part of the book series: Advances in Intelligent Systems and Computing ((AISC,volume 755))

Abstract

Thermal and mass diffusion of time-dependent hydromagnetic second-order fluid through porous medium has been considered. The porous medium is formed between two vertical parallel plates. The buoyancy force generates the free convection. In this investigation the effect of external heat agency is also considered. The governing equations of the flow field are solved using regular perturbation technique. The expressions for velocity, temperature concentration and skin friction are obtained analytically. The variation of skin friction with the combination of different flow parameters computed using MATLAB software is represented graphically.

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Acknowledgements

I gratefully acknowledge to Dr. R. Choudhury, Professor, Department of Mathematics, Gauhati University for her valuable help during the preparation of the paper.

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Authors and Affiliations

  1. Silchar Collegiate School, Tarapur, Silchar, 788003, Assam, India

    Hridi Ranjan Deb

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  1. Hridi Ranjan Deb
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Correspondence to Hridi Ranjan Deb .

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Editors and Affiliations

  1. Machine Intelligence Research Labs, Auburn, WA, USA

    Ajith Abraham

  2. Department of Computer and Systems Sciences, Visva-Bharati University, Santiniketan, West Bengal, India

    Paramartha Dutta

  3. Department of Computer Science and Engineering, University of Kalyani, Kalyani, India

    Jyotsna Kumar Mandal

  4. Institute of Engineering and Management, Kolkata, West Bengal, India

    Abhishek Bhattacharya

  5. Institute of Engineering and Management, Kolkata, West Bengal, India

    Soumi Dutta

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Deb, H.R. (2019). Second-Order Fluid Through Porous Medium in a Rotating Channel with Hall Current. In: Abraham, A., Dutta, P., Mandal, J., Bhattacharya, A., Dutta, S. (eds) Emerging Technologies in Data Mining and Information Security. Advances in Intelligent Systems and Computing, vol 755. Springer, Singapore. https://doi.org/10.1007/978-981-13-1951-8_33

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