Abstract
Cu–Ni–Si system alloys have been the research hotspots because of high strength and high electrical conductivity in recent years. In this study, the influence of Co addition on microstructure and properties of Cu–Ni–Si alloys were investigated by transmission electron microscopy (TEM) and high resolution transmission electron microscopy (HRTEM). The result shows that the hardness of alloys increase firstly, gradually decline and leveled off while reaching a certain peak with the prolongation of aging time, which the electrical conductivity gradually increased. The best integrated performance is obtained at 500 °C aging for 4 h, which reaches the peak value of 233 HV and the conductivity was 37.3% IACS, the ultimate and yield strength reached 583 and 496 MPa, At the same time, the ductility of Cu–Ni–Si–Co alloy reached 12.9%. The phases of (Ni, Co)2Si precipitated with the addition of Co, which strengthens the alloy and enhances the mechanical properties. However, the formation of Co2Si phase leads to Ni element dissolved in the matrix, which gives rise to the reduction of conductivity.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
X.P. Xiao, B.Q. Xiong, Q.S. Wang et al., Age-hardening characteristics of Cu–Ni–Si alloy after cold deformation. Appl. Mech. Mater. 217–219, 294–298 (2012)
W. Wang, H. Kang, Z. Chen et al., Effects of Cr and Zr additions on microstructure and properties of Cu–Ni–Si alloys. Mater. Sci. Eng.: A 673, 378–390 (2016)
E. Lee, S. Han, K. Euh et al., Effect of Ti addition on tensile properties of Cu–Ni–Si alloys. Met. Mater. Int. 17(4), 569–576 (2011)
J.Y. Cheng, B.B. Tang, F.X. Yu et al., Evaluation of nanoscaled precipitates in a Cu–Ni–Si–Cr alloy during aging. J. Alloy. Compd. 614, 189–195 (2014)
T. Hu, J.H. Chen, J.Z. Liu, Z.R. Liu, C.L. Wu, Acta Mater. 61, 1210–1219 (2013)
D.M. Zhao, Q.M. Dong, P. Liu et al., Structure and strength of the age hardened Cu–Ni–Si alloy. Mater. Chem. Phys. 79(1), 81–86 (2003)
S.Z. Han, L.S. Hwan, K. Sangshik et al., Increasing strength and conductivity of Cu alloy through abnormal plastic deformation of an intermetallic compound. Sci. Rep. 6, 30907 (2016)
L.J. Peng, B.Q. Xiong, G.L. Xie et al., Precipitation process and its effects on properties of aging Cu–Ni–Be alloy. Rare Met. 32(4), 332–337 (2013)
K. Wang, K.F. Liu, J.B. Zhang, Microstructure and properties of aging Cu–Cr–Zr alloy. Rare Met. 33(2), 134 (2014)
X.P. Xiao, Z.Y. Yi, T.T. Chen et al., Suppressing spinodal decomposition by adding Co into Cu–Ni–Si alloy. J. Alloy. Compd. 660, 178–183 (2016)
Q. Lei, Z. Li, C. Dai et al., Effect of aluminum on microstructure and property of Cu–Ni–Si alloys. Mater. Sci. Eng.: A Struct. Mater. Prop. Microstruct. Process. 572(6), 65–74 (2013)
C. Watanabe, F. Nishijima, R. Monzen et al., Mechanical properties of Cu–4.0 wt%Ni–0.95 wt%Si alloys with and without P and Cr Addition. Mater. Sci. Forum 561–565, 2321–2324 (2007)
Q.S. Wang, G.L. Xie, X.J. Mi et al., The precipitation and strengthening mechanism of Cu–Ni–Si–Co alloy, in Materials Science Forum, vol. 749 (Trans Tech Publications, 2013), pp. 294–298
S.Z. Han, L.S. Hwan, K. Sangshik et al., Increasing strength and conductivity of Cu alloy through abnormal plastic deformation of an intermetallic compound. Sci. Rep. 6, 30907 (2016)
Acknowledgements
Our study is supported by the National Key R&D Program of China (No. 2016YFB0301300).
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2018 Springer Nature Singapore Pte Ltd.
About this paper
Cite this paper
Li, J., Huang, G., Mi, X., Peng, L., Xie, H., Kang, Y. (2018). Effect of Co Addition on Microstructure and Properties of Cu–Ni–Si Alloy. In: Han, Y. (eds) Advances in Materials Processing. CMC 2017. Lecture Notes in Mechanical Engineering. Springer, Singapore. https://doi.org/10.1007/978-981-13-0107-0_33
Download citation
DOI: https://doi.org/10.1007/978-981-13-0107-0_33
Published:
Publisher Name: Springer, Singapore
Print ISBN: 978-981-13-0106-3
Online ISBN: 978-981-13-0107-0
eBook Packages: EngineeringEngineering (R0)