Abstract
The aim of this article is to study the effect of intermediate annealing on the interface and plasticity of Cu–Ni–Si/Al–Mg–Si clad composite wires. Cu–Ni–Si/Al–Mg–Si clad composite wires were produced by cold drawing process and annealed at the temperature from 150 to 350 °C for 0.5 h. The presence of various intermetallic compounds in different temperature was detected by scanning electron microscope and EDS analyzer. The mechanical properties were measured by stretch test. The elongation increased with the temperature increment. The morphology of fracture showed that intermetallic compounds were tough and brittle. During the subsequent drawing, the intermetallic compounds were harmful to the overall structure of composite wires. The elongation cannot identify the plasticity of copper-clad aluminum (CCA) composite wires accurately.
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References
Ahmed N., Extrusion of copper clad aluminum wire, J. Mech. Work. Technol. 2 (1978) 19–32.
K. Y. Rhee, W. Y. Han, H. J. Park, Fabrication of aluminum/copper clad composite using hot hydrostatic extrusion process and its material characteristics, Mater. Sci. Eng., A. 384 (2004) 70–76.
T. Sapanathan, S. Khoddam, S. H. Zahiri, Spiral extrusion of aluminum/copper composite for future manufacturing of hybrid rods: A study of bond strength and interfacial characteristics, J. Alloys Compd. 571 (2013) 85–92.
X. F. Hu, H. M. Zheng, J. W. Cui, The effect of Sc on the performance of copper clad aluminum magnesium busbar, J. Funct Mater. Dev. 5 (2015) 154–159.
X. Ji, H. Zhang, S. Luo, Microstructures and properties of Al-Mg-SI alloy overhead conductor by horizontal continuous casting and continuous extrusion forming process, Mater. Sci. Eng., A. 649 (2016) 128–134.
H. L. Seet, X. P. Li, K. S. Lee, Cold drawing of micro Ni80Fe20/Cu composite wires, J. Mater. Process. Technol. 192–193 (2007) 350–354.
S. LEE, M. LEE, S. LEE, Effect of bonding interface on delamination behavior of drawn Cu/Al bar clad material, T. Nonferr. Metal. Soc. 22 (2012) 645–649.
I. K. Kim, H. Sun. Mechanochemical joining in cold roll-cladding of tri-layered Cu/Al/Cu composite and the interface cracking behavior, Mater. Des. 57 (2014) 625–631.
M. Abbasi, T. A. Karimi, M. T. Salehi, Growth rate of intermetallic compounds in Al/Cu bimetal produced by cold roll welding process, J. Alloys Compd. 319 (2001) 233–241.
A. Gueydan, B. Domenges, E. Hug, Study of the intermetallic growth in copper-clad aluminum wires after thermal aging, Intermetallics. 50 (2014) 34–42.
J. Lei, P. Liu, D. Zhao, Recrystallization Behavior of Re-aged Cu–Ni–Si Alloy, Shanghai, China, 2004.
E. Hug, N. Billido, Brittleness study of intermetallic (Cu, Al) layers in copper-clad aluminium thin wires, Mater. Sci. Eng., A. 528 (2011) 7103–7106.
C. Chen, Effect of Annealing on the Interfacial Structure of Aluminum-Copper Joints, Mater. Trans. 7 (2007) 1938–1947.
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Yang, Z. et al. (2018). Effect of Intermediate Annealing on the Interface and Plasticity of Cu–Ni–Si/Al–Mg–Si Clad Composite Wires. In: Han, Y. (eds) High Performance Structural Materials. CMC 2017. Springer, Singapore. https://doi.org/10.1007/978-981-13-0104-9_91
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DOI: https://doi.org/10.1007/978-981-13-0104-9_91
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