Abstract
In this paper, large dimension WTi alloy target for 12 in. wafers was respectively diffusion bonded to Al alloy, Cu alloy or Mo back plate. Then the properties test of the overall deformation after bonding, interface microstructure, bonding rate, tensile strength were conducted. The results showed that after the large dimension WTi alloy target bonded to the Al alloy or Cu alloy back plate, the overall deformation was large, the target was easily crack or debonding, so the reliability was poor. After the WTi alloy target bonded to the Mo back plate, the overall deformation was small, the bonding rate could reach more than 99%, and the tensile strength could be more than 50 MPa which was better than the traditional solder bonding strength (<5 MPa) and could meet the high power sputtering.
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Ding, Z., Yu, H., Wan, X., Chen, M., Wang, Y., Lei, J. (2018). Diffusion Bonding Properties of Large Dimension WTi Alloy Target Bonded to the Back Plate. In: Han, Y. (eds) High Performance Structural Materials. CMC 2017. Springer, Singapore. https://doi.org/10.1007/978-981-13-0104-9_104
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DOI: https://doi.org/10.1007/978-981-13-0104-9_104
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Online ISBN: 978-981-13-0104-9
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