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International Symposium on Shock Waves

ISSW 2017: 31st International Symposium on Shock Waves 2 pp 437–442Cite as

Analysis of Deformation Process of a Bubble in an Elastic Capsule by Shock Waves and Their Medical and Biological Applications

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Abstract

This paper describes culture regeneration system combining cultivation promotion and capsule destruction using shock wave, especially the basic mechanism for its development such as deformation process of a bubble in a microcapsule composed of membrane, liquid, and gas bubble. Necessary tasks to optimize the improvement of cell culture rate and the microcapsule disintegration rate by pressure control are (1) investigation of the influence of amount of gas bubbles and pressure waveform on the threshold of capsule destruction due to bubble collapse and (2) estimation of threshold of pressure for the collapse. It is concluded that (1) maximum amplitude of bubble, which corresponds to the degree of damage, is decreasing as the gas ratio is increasing, and (2) maximum amplitude of bubble is also decreasing as the duration time becomes smaller order.

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References

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Authors and Affiliations

  1. Graduate School of Life Science and Systems Engineering, Kyushu Institute of Technology, Kitakyushu, Japan

    M. Tamagawa, T. Imakado & R. Ogasahara

Authors
  1. M. Tamagawa
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  2. T. Imakado
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  3. R. Ogasahara
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Corresponding author

Correspondence to M. Tamagawa .

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Editors and Affiliations

  1. Department of Aerospace Engineering, Nagoya University, Nagoya, Japan

    Akihiro Sasoh

  2. Department of Energy and Environmental Engineering, Kyushu University, Kasuga, Fukuoka, Japan

    Toshiyuki Aoki

  3. Institute of Innovative Research, Tokyo Institute of Technology, Tokyo, Japan

    Masahide Katayama

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Tamagawa, M., Imakado, T., Ogasahara, R. (2019). Analysis of Deformation Process of a Bubble in an Elastic Capsule by Shock Waves and Their Medical and Biological Applications. In: Sasoh, A., Aoki, T., Katayama, M. (eds) 31st International Symposium on Shock Waves 2. ISSW 2017. Springer, Cham. https://doi.org/10.1007/978-3-319-91017-8_56

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  • DOI: https://doi.org/10.1007/978-3-319-91017-8_56

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-91016-1

  • Online ISBN: 978-3-319-91017-8

  • eBook Packages: EngineeringEngineering (R0)

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