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Millimeter-Wave Substrates and System-Level Approach in Millimeter-Wave Research and Design

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Millimeter-Wave Integrated Circuits

Part of the book series: Lecture Notes in Electrical Engineering ((LNEE,volume 658))

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Abstract

With device scaling, the number and the density of components that can be placed on chip increase. With every new process generation, more and more active devices can be placed into a small area of the IC chip. The phenomenon that is now known as Moore’s law indicates that the circuit density roughly doubles every 18 or 24 months.

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Notes

  1. 1.

    Packaging, in the microelectronics context, refers to an enclosure placed around electronic circuits to protect them from the influence of the environment (e.g. pressure, impact and moisture). Because packaging cannot be avoided, one cannot escape the fact that it directly influences circuit performance.

  2. 2.

    FR used to stand for “fire-resistant”. Nowadays, FR4 is used without definition.

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Authors and Affiliations

  1. University of Johannesburg, Johannesburg, Gauteng, South Africa

    Mladen Božanić & Saurabh Sinha

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  1. Mladen Božanić
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Correspondence to Mladen Božanić .

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Božanić, M., Sinha, S. (2020). Millimeter-Wave Substrates and System-Level Approach in Millimeter-Wave Research and Design. In: Millimeter-Wave Integrated Circuits. Lecture Notes in Electrical Engineering, vol 658. Springer, Cham. https://doi.org/10.1007/978-3-030-44398-6_3

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  • DOI: https://doi.org/10.1007/978-3-030-44398-6_3

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