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Circuits for Electronic-Photonic Integration

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Silicon Optoelectronic Integrated Circuits

Part of the book series: Springer Series in Advanced Microelectronics ((MICROELECTR.,volume 13))

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Abstract

In this chapter newest research on three-dimensional integration is described. Three promising methods for 3D integration of using copper micro pillars, interwafer connects, and through-silicon vias are introduced. The application of these 3D-integration techniques in the integration of photonic chips on top of electronic chips is described subsequently. Four application examples, a multi-node optical switch, a transceiver, a sensor for optical tomography, and a sensor for 3D microimaging are explained in detail from system architecture down to the transistor level.

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    Horst Zimmermann

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Zimmermann, H. (2018). Circuits for Electronic-Photonic Integration. In: Silicon Optoelectronic Integrated Circuits. Springer Series in Advanced Microelectronics, vol 13. Springer, Cham. https://doi.org/10.1007/978-3-030-05822-7_7

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