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Fabrication and Packaging of Downhole Instruments

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Instruments, Measurement Principles and Communication Technologies for Downhole Drilling Environments

Part of the book series: Smart Sensors, Measurement and Instrumentation ((SSMI,volume 32))

Abstract

This chapter provides an overview of the fabrication and packaging methods for downhole environments. Operation in harsh and critical environments requires instruments to meet stringent safety standards. Therefore, all layers of a downhole instrument, such as electronic circuits, components, integrated circuit modules along with encapsulation and packaging, are carefully designed, planned and tested for safe and optimal operation in a well.

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Author information

Authors and Affiliations

  1. Drilling Technology Division, EXPEC ARC, Dhahran, Saudi Arabia

    Chinthaka P. Gooneratne

  2. Drilling Technology Division, EXPEC ARC, Dhahran, Saudi Arabia

    Bodong Li

  3. Aramco Research Center, Houston, TX, USA

    Max Deffenbaugh

  4. Drilling Technology Division, EXPEC ARC, Dhahran, Saudi Arabia

    Timothy Moellendick

Authors
  1. Chinthaka P. Gooneratne
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  2. Bodong Li
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  3. Max Deffenbaugh
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  4. Timothy Moellendick
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Corresponding author

Correspondence to Chinthaka P. Gooneratne .

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Gooneratne, C.P., Li, B., Deffenbaugh, M., Moellendick, T. (2019). Fabrication and Packaging of Downhole Instruments. In: Instruments, Measurement Principles and Communication Technologies for Downhole Drilling Environments. Smart Sensors, Measurement and Instrumentation, vol 32. Springer, Cham. https://doi.org/10.1007/978-3-030-04900-3_6

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  • DOI: https://doi.org/10.1007/978-3-030-04900-3_6

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-030-04899-0

  • Online ISBN: 978-3-030-04900-3

  • eBook Packages: EngineeringEngineering (R0)

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