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Advances in Cryogenic Engineering Materials pp 1329–1336Cite as

(Nb,Ti)3Sn/CU Multifilamentary Superconducting Wire with Nb/Ti and Nb/NbTi Composite Filaments

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Part of the book series: Advances in Cryogenic Engineering ((ACRE,volume 42))

Abstract

Ternary (Nb,Ti)3Sn/Cu multifilamentary high-field superconducting wires with Nb/Ti and Nb/NbTi composite filaments were fabricated via a bronze-route process. The composite filaments, which contain about 1.3 wt.% Ti, were prepared from pure Nb and Ti sheets, or pure Nb and Nb47Ti alloy sheets using a jelly-roll technique. The ternary Al 5 superconducting phase is formed during final heat treatment by diffusion of Sn and Ti through matrix and filaments respectively, and then reaction with Nb. This new approach is designed to improve the workability and piece length as well as to reduce the cost of manufacturing (Nb,Ti)3Sn/Cu superconducting wires. A two-stage reaction heat treatment schedule has been developed to generate high Jc for these ternary A15 superconductors with composite filaments. Non-Cu Jc(12T,0.1μV/cm,4.2K) of~ 670A/mm2 was recorded on the wire with Nb/Nb47Ti composite filaments fabricated using this technique.

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Authors and Affiliations

  1. Supercon, Inc., Shrewsbury, MA, 01545, USA

    D. Yu, K. De Moranville, T. Wong & J. Wong

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  1. D. Yu
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  2. K. De Moranville
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  3. T. Wong
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  4. J. Wong
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Editor information

Editors and Affiliations

  1. Lawrence Livermore National Laboratory, University of California, Livermore, California, USA

    Leonard T. Summers

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© 1996 Springer Science+Business Media New York

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Yu, D., De Moranville, K., Wong, T., Wong, J. (1996). (Nb,Ti)3Sn/CU Multifilamentary Superconducting Wire with Nb/Ti and Nb/NbTi Composite Filaments. In: Summers, L.T. (eds) Advances in Cryogenic Engineering Materials . Advances in Cryogenic Engineering Materials , vol 42. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-9059-7_172

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  • DOI: https://doi.org/10.1007/978-1-4757-9059-7_172

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4757-9061-0

  • Online ISBN: 978-1-4757-9059-7

  • eBook Packages: Springer Book Archive

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