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Superconductive Electronics with High Transition Temperature Films

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Advances in Cryogenic Engineering Materials

Part of the book series: An International Cryogenic Materials Conference Publication ((ACRE,volume 40))

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Abstract

Electronics based on high transition temperature superconductive thin film materials is presently viable in some important niches, particularly in passive microwave circuits. Applications requiring Josephson junctions are impeded by the lack of reproducible junctions, but the junctions that can be produced are good candidates for the new Rapid Single Flux Quantum class of extremely fast digital circuits. Other devices that take advantage of the weak fluxoid pinning of some films are also promising, particularly the flux flow transistor. The availability of both Josephson and flux flow devices at 77 K invites exploration of hybrid technologies using HTS multi-chip modules supporting silicon CMOS chips and superconductive chips at the same time. The superconductive contribution to the emerging applications can result in significant performance advantages, particularly in remote sensing and communications.

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Authors and Affiliations

  1. Westinghouse Science and Technology Center, Pittsburgh, PA, 15235, USA

    A. Davidson, J. Talvacchio, M. G. Forrester & J. R. Gavaler

Authors
  1. A. Davidson
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  2. J. Talvacchio
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  3. M. G. Forrester
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  4. J. R. Gavaler
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Editor information

Editors and Affiliations

  1. Cryogenic Materials, Inc., Boulder, Colorado, USA

    Richard P. Reed

  2. U.S. Department of Commerce, National Institute of Standards and Technology, Boulder, Colorado, USA

    Fred R. Fickett

  3. National High Magnetic Field Laboratory, Florida State University, Tallahassee, Florida, USA

    Leonard T. Summers

  4. MS Publications, Boulder, Colorado, USA

    M. Stieg

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© 1994 Springer Science+Business Media New York

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Davidson, A., Talvacchio, J., Forrester, M.G., Gavaler, J.R. (1994). Superconductive Electronics with High Transition Temperature Films. In: Reed, R.P., Fickett, F.R., Summers, L.T., Stieg, M. (eds) Advances in Cryogenic Engineering Materials . An International Cryogenic Materials Conference Publication, vol 40. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-9053-5_44

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  • DOI: https://doi.org/10.1007/978-1-4757-9053-5_44

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4757-9055-9

  • Online ISBN: 978-1-4757-9053-5

  • eBook Packages: Springer Book Archive

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