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Advances in Cryogenic Engineering Materials pp 1421–1428Cite as

Analysis of Mechanical Rigidity Simulates Superconducting Coil Pack at Low Temperature

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Part of the book series: An International Cryogenic Materials Conference Publication ((ACRE,volume 40))

Abstract

The helical coil in the Large Helical Device (LHD) is subject to high electromagnetic force above 10 MN/m. The large deformations and high stress fields of the coils cause the instabilities of the superconducting and influence to the plasma confinement due to the deformation of the device. Coils must have enough rigidity to bear this electromagnetic force. To investigate the rigidity of the helical coils, finite element method and mixture law were applied to calculate apparent rigidity of coil pack that simulated the section of actual helical coil. Elastic modulus of insulator were varied in calculation and representative results showed good agreements with the results of the experiments1.

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References

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Author information

Authors and Affiliations

  1. National Institute for Fusion Science, Furocho, Chikusa, Nagoya, 464-01, Japan

    Hitoshi Tamura, Arata Nishimura, Toshiyuki Mito, Junya Yamamoto & Osamu Motojima

  2. Tohoku University, Aoba, Aramaki, Aoba Sendai, 980, Japan

    Yuji Takagi & Yasuhide Shindo

Authors
  1. Hitoshi Tamura
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  2. Yuji Takagi
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  3. Yasuhide Shindo
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  4. Arata Nishimura
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  5. Toshiyuki Mito
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  6. Junya Yamamoto
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  7. Osamu Motojima
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Consortia

LHD group

Editor information

Editors and Affiliations

  1. Cryogenic Materials, Inc., Boulder, Colorado, USA

    Richard P. Reed

  2. U.S. Department of Commerce, National Institute of Standards and Technology, Boulder, Colorado, USA

    Fred R. Fickett

  3. National High Magnetic Field Laboratory, Florida State University, Tallahassee, Florida, USA

    Leonard T. Summers

  4. MS Publications, Boulder, Colorado, USA

    M. Stieg

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© 1994 Springer Science+Business Media New York

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Tamura, H. et al. (1994). Analysis of Mechanical Rigidity Simulates Superconducting Coil Pack at Low Temperature. In: Reed, R.P., Fickett, F.R., Summers, L.T., Stieg, M. (eds) Advances in Cryogenic Engineering Materials . An International Cryogenic Materials Conference Publication, vol 40. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-9053-5_181

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  • DOI: https://doi.org/10.1007/978-1-4757-9053-5_181

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4757-9055-9

  • Online ISBN: 978-1-4757-9053-5

  • eBook Packages: Springer Book Archive

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