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Advances in Cryogenic Engineering Materials pp 1113–1119Cite as

Fracture Toughness and Relaxation of Epoxy Resins at Cryogenic Temperatures

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Part of the book series: An International Cryogenic Materials Conference Publication ((ACRE,volume 40))

Abstract

The relationship between fracture toughness and several epoxy resins has been investigated at cryogenic temperatures. Resins for cryogenic use are thought to require high fracture toughness at cryogenic temperatures. The fracture toughness and mechanical and dielectric relaxation of resins were studied at low temperature. The amount of plasticizer and molecular weight between crosslinks was varied. It was found that the fracture toughness had a close relation to the relaxation behavior, and hence, the effect of plasticizer disappeared at liquid helium temperature. The resin with larger epoxide equivalent had a higher fracture toughness even at liquid helium temperature. This suggests a guideline for the molecular design for the resin with high fracture toughness at cryogenic temperature.

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References

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Author information

Author notes

  1. Yuichi Ohtani

    Present address: Takasago Research and Development Center, Mitsubishi Heavy Industries, LTD., Japan

Authors and Affiliations

  1. ISIR, Osaka University, Ibaraki, Osaka 567, Japan

    Fumio Sawa, Shigehiro Nishijima, Yuichi Ohtani, Kenichi Matsushita & Toichi Okada

Authors
  1. Fumio Sawa
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  2. Shigehiro Nishijima
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  3. Yuichi Ohtani
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  4. Kenichi Matsushita
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  5. Toichi Okada
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Editor information

Editors and Affiliations

  1. Cryogenic Materials, Inc., Boulder, Colorado, USA

    Richard P. Reed

  2. U.S. Department of Commerce, National Institute of Standards and Technology, Boulder, Colorado, USA

    Fred R. Fickett

  3. National High Magnetic Field Laboratory, Florida State University, Tallahassee, Florida, USA

    Leonard T. Summers

  4. MS Publications, Boulder, Colorado, USA

    M. Stieg

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© 1994 Springer Science+Business Media New York

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Sawa, F., Nishijima, S., Ohtani, Y., Matsushita, K., Okada, T. (1994). Fracture Toughness and Relaxation of Epoxy Resins at Cryogenic Temperatures. In: Reed, R.P., Fickett, F.R., Summers, L.T., Stieg, M. (eds) Advances in Cryogenic Engineering Materials . An International Cryogenic Materials Conference Publication, vol 40. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-9053-5_141

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  • DOI: https://doi.org/10.1007/978-1-4757-9053-5_141

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4757-9055-9

  • Online ISBN: 978-1-4757-9053-5

  • eBook Packages: Springer Book Archive

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