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Long-Crack Fatigue Thresholds and Short Crack Simulation at Liquid Helium Temperature

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Materials

Part of the book series: Advances in Cryogenic Engineering ((ACRE,volume 38))

Abstract

A short crack simulation (SCS) test is used to characterize the near—threshold fatigue crack growth behavior of stainless steels at 4 K. The test methodology holds the maximum stress intensity factor constant while increasing the minimum stress intensity factor, thus raising the stress ratio from 0.1 at the start to about 0.8 at the end of the test. The resulting fatigue crack growth rate measurements are unaffected by crack closure, and the intrinsic threshold is directly obtained without a correction factor. Merits of the test procedure are described.

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Author information

Author notes

  1. J. R. Berger

    Present address: Dept. of Aerospace and Mechanical Engineering, University of Notre Dame, Notre Dame, IN, USA

Authors and Affiliations

  1. Materials Reliability Division, National Institute of Standards and Technology, Boulder, Colorado, 80303, USA

    R. L. Tobler, J. R. Berger & A. Bussiba (Visiting Scientist)

  2. Nuclear Research Center-Negev, Beer-Sheva, Israel

    A. Bussiba (Visiting Scientist)

Authors
  1. R. L. Tobler
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  2. J. R. Berger
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  3. A. Bussiba
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Editor information

Editors and Affiliations

  1. National Institute of Standards and Technology, U.S. Department of Commerce, Boulder, Colorado, USA

    F. R. Fickett

  2. Cryogenic Materials, Inc., Boulder, Colorado, USA

    R. P. Reed

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© 1992 Springer Science+Business Media New York

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Tobler, R.L., Berger, J.R., Bussiba, A. (1992). Long-Crack Fatigue Thresholds and Short Crack Simulation at Liquid Helium Temperature. In: Fickett, F.R., Reed, R.P. (eds) Materials. Advances in Cryogenic Engineering, vol 38. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-9050-4_20

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  • DOI: https://doi.org/10.1007/978-1-4757-9050-4_20

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4757-9052-8

  • Online ISBN: 978-1-4757-9050-4

  • eBook Packages: Springer Book Archive

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