Skip to main content
Book cover

Materials pp 127–132Cite as

1100 Hour Creep Test Results for OFHC Copper: Validation of Previously Published Results

  • Chapter
  • 517 Accesses

Part of the book series: Advances in Cryogenic Engineering ((ACRE,volume 38))

Abstract

Results of 77 Kelvin creep tests on OFHC copper specimens have been obtained and are shown to support previously published results presented by researchers at the National Institute of Standards and Technology (NIST). The reproduction of the copper results obtained by NIST using the Texas A&M system provides credibility to both systems. This is particularly important when the lack of commercial cryogenic creep systems results in individualized measurement techniques and the degree of measurement difficulty is high. A suggested standard for the simplified comparison of materials which exhibit “exhaustive” creep behavior is also given.

This is a preview of subscription content, log in via an institution.

Buying options

Chapter
USD   29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD   169.00
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD   219.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD   219.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Learn about institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. L. C. McDonald and K. T. Hartwig, Creep of Pure Aluminum at Cryogenic Temperatures, Adv. in Cryogenic Engr. Mat. 36:1135 (1990).

    Google Scholar 

  2. R. P. Reed, N. J. Simon, and R.P. Walsh, Creep of Copper: 4 to 295 K, Adv. in Cryogenic Engr. Mat. 36:1175 (1990).

    Google Scholar 

  3. L. C. McDonald and K. T. Hartwig, Cryogenic Creep Testing, J. Testing and Evaluation Vol 19, No. 3, March 1991.

    Google Scholar 

  4. C. Yen, T. Caulfield, L. D. Roth, J. M. Wells, and J. K. Tien, Creep of Copper at Cryogenic Temperatures, J. Cryogenics 24: 381 (1984).

    Google Scholar 

  5. C. T. Yen, L. D. Roth, J. M. Wells, and J. K. Tien, Equipment for Long-term Creep Testing at Cryogenic Temperatures, J. Cryogenics 24:410 (1984).

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Editor information

Editors and Affiliations

Rights and permissions

Reprints and permissions

Copyright information

© 1992 Springer Science+Business Media New York

About this chapter

Cite this chapter

McDonald, L.C., Hartwig, K.T. (1992). 1100 Hour Creep Test Results for OFHC Copper: Validation of Previously Published Results. In: Fickett, F.R., Reed, R.P. (eds) Materials. Advances in Cryogenic Engineering, vol 38. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-9050-4_16

Download citation

  • DOI: https://doi.org/10.1007/978-1-4757-9050-4_16

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4757-9052-8

  • Online ISBN: 978-1-4757-9050-4

  • eBook Packages: Springer Book Archive

Publish with us

Policies and ethics