Abstract
Numerous studies have appeared which compare various packaging technologies [5.1–5.16]. These studies contain valuable information about the general applicability of one technology or material over another. Application specific tradeoff studies have also appeared, but are less prevalent than generic treatments [5.17–5.23]. These studies present tradeoff analyses for specific real modules.
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© 1994 Springer Science+Business Media New York
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Sandborn, P.A., Moreno, H. (1994). Tradeoff Analyses for Multichip Systems. In: Conceptual Design of Multichip Modules and Systems. The Springer International Series in Engineering and Computer Science, vol 250. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-4841-3_5
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