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Abstract

We review the main trends observed when cooling III–V High Electron Mobility Transistors (HEMT’s) and Heterojunction Bipolar Transistors (HBT’s) with a special interest for their high frequency (HF) properties. If there are some references dealing with the temperature parameter dependence of GaAs devices, there are few data published on InP transistors and their intrinsic parameters at low temperature (LT) down to liquid nitrogen temperature (LNT) and beyond. There is a large amount of informations available on GaAs MESFET’s, HEMT’s and HBT’s in the temperature range from 125°C to −50°C [1], but there are few ones at lower temperature. In [1] the MESFET was treated in depth, including self-heating but noise was not considered. In this chapter, section 1 is devoted to the LT carrier transport properties of the III–V semiconductors used in state of the art HF transistors. We discuss in section 2 the HEMT static, dynamic and HF noise properties at low temperature with the main emphasis on the InP HEMT. In section 3 we investigate in a similar way the low temperature behaviour of the InP HBT. As often as possible, the data are compared with corresponding performances of cooled GaAs devices and of state of the art transistors at 300K. Basic aspects about HEMT’s and HBT’s can be found in [2] and [5].

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Aniel, F., Adde, R. (2001). Heterojunction Transistors at Low Temperature. In: Balestra, F., Ghibaudo, G. (eds) Device and Circuit Cryogenic Operation for Low Temperature Electronics. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-3318-1_5

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