Abstract
Chapter 5 reports on the application of FEA modeling and simulation techniques used for design of package assembly design for reliability. FEA modeling techniques have been developed for three-dimensional models, sub-modeling, and global–local modeling techniques. The global–local 3D modeling techniques like sub-modeling and Global–Local-Beam (GLB) methods, were applied to model solder joint reliability behavior for various test cases of thermal cycling, vibration, and impact drop tests. Implementation of the nonlinear mechanics of materials models have been integrated to the ANSYS finite element analysis program.
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Clough RW (1960) The finite element method in plane stress analysis. Proceedings, American society of civil engineers, 2nd conference on electronic computation, Pittsburgh, Pennsylvania, 23, pp 345–378
Desai CS, Abel JF (1987) Introduction to the finite element method-a numerical method for engineering analysis. CBS Publishers & Distributors, India
Ansys Version 7.0 Manual (2002). Ansys Inc.
Pang JHJ, Chong DYR, Low TH (2001) Thermal cycling analysis of flip-chip solder joint reliability. IEEE Trans Components Packaging Technol 24(4):705–712
Darveaux R (2000) Effect of simulation methodology on solder joint crack growth correlation. 50th Electronic components and technology conference, Las Vegas, Nevada, 21–24 May 2000, pp 1048–1058
Pang JHL, Seetoh CW, Wang ZP (2000) CBGA solder joint reliability evaluation based on elastic-plastic-creep analysis. J Electron Packaging 122:255–261
Anderson T, Guven EM (1999) The necessity of reexamining previous life prediction analyses of solder joints in electronic packages. 49th Electronic components and technology conference, pp 1010–1014
Yao Q, Qu J (1999) Three-dimensional versus two-dimensional finite element modeling of flip-chip packages. J Electron Packaging 121:196–201
Pang JHL, Low TH, Xiong BS, Che FX (2003) Design for reliability (DFR) methodology for electronic packaging assemblies. Proceedings of 5th EPTC conference, Singapore, 10–12 December 2003, pp 470–478
Cheng HC, Chiang KN, Lee MH (1998) An effective approach for three-dimensional finite element analysis of ball grid array typed packages. J Electron Packaging 120:129–134
Yu Q, Shiratori M, Wang SB (1993) Stress analysis of surface-mount assembly by an influence function method. Advances in electronic packaging, ASME international electronic conference, EEP-vol 4–1, Binghamton, New York, 29 September–2 October
Anderson T, Barut A, Guven I, Madenci E (2000) Revisit of life-prediction model for solder joints. 50th Electronic components and technology conference, Las Vegas, Nevada, 21–24 May 2000
Gustafsson G, Guven I, Kradinov V, Madenci E (2000) Finite element modeling of BGA packages for life prediction. 50th Electronic components and technology conference, Las Vegas, Nevada, 21–24 May 2000
Zhu J (1999) Three-dimensional effects of solder joints in micro-scale BGA assembly. J Electron Packaging 121:297–302
Zhu J, Quander S, Reinikainen T (2001) Global/local modeling for PWB mechanical loading. 51th Electronic components and technology conference, Orlando, FL, USA, 29 May–1 June
Saito N, Sasaki K, Hata N (1999) Effective stress and displacement analysis method for area-array structures. Advances in electronic packaging, ASME international electronic conference, EEP-vol 26–1
Yang QJ, et al (1999). Vibration reliability analysis of a PBGA assembly under foundation excitations. Advances in electronic packaging, ASME international electronic conference, EEP-vol 26–1
Cheng FY (2001) Matrix analysis of structural dynamics: applications and earthquake engineering. Marcel Dekker, New York
Cheng ZN, Wang GZ, Chen L, Wilde J, Becker K (2000) Viscoplastic Anand model for solder alloys and its application. Soldering & Surface Mount Technol 12(2):31–36
Shi XQ, Pang HLJ, Zhou W, Wang ZP (2000) Low cycle fatigue analysis of temperature and frequency effects in eutectic solder alloy. Int J fatigue 22(3):217–228
Shi XQ, Pang HLJ, Zhou W, Wang ZP (1999) A modified energy-based low cycle fatigue model for eutectic solder alloy. Scr Mater 41(3):289–296
Pang JHL, Low TH, Che FX (2004) Lead free 95.5Sn-3.8Ag-0.7Cu solder joint reliability analysis of Micro-BGA assembly. Proceedings of ITherm 2004 conference, Las Vegas, 1–4 June 2004
Amagai M (1999) Chip scale package (CSP) solder joint reliability and modeling. Microelectron Reliab 39:463–477
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Pang, J.H.L. (2012). Finite Element Analysis and Design-for-Reliability. In: Lead Free Solder. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-0463-7_5
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DOI: https://doi.org/10.1007/978-1-4614-0463-7_5
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