Abstract
Chapter 2 reviews the fundamental theory on mechanics of solder materials. As solder materials are subject to high operating temperatures relative to their melting point, the thermo-mechanical deformation response of the solder is dependent on both temperature and strain-rate conditions. Hence, the theory on mechanics of solder materials will focus on elastic-plastic-creep and viscoplastic models for describing the thermo-mechanical deformation response of lead-free solder materials operating over a wide range of temperatures (−40°C to +125°C) and strain rates (0.0001–1,000 s−1).
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Pang, J.H.L. (2012). Theory on Mechanics of Solder Materials. In: Lead Free Solder. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-0463-7_2
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DOI: https://doi.org/10.1007/978-1-4614-0463-7_2
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