Advertisement

Electromagnetic Compatibility of Integrated Circuits

Techniques for low emission and susceptibility

  • Sonia Ben Dhia
  • Mohamed Ramdani
  • Etienne Sicard

Table of contents

  1. Front Matter
    Pages i-xiii
  2. Sonia Ben Dhia, Mohamed Ramdani, Etienne Sicard
    Pages 1-17
  3. Sonia Ben Dhia, Mohamed Ramdani, Etienne Sicard
    Pages 19-54
  4. Sonia Ben Dhia, Mohamed Ramdani, Etienne Sicard
    Pages 55-104
  5. Sonia Ben Dhia, Mohamed Ramdani, Etienne Sicard
    Pages 105-187
  6. Sonia Ben Dhia, Mohamed Ramdani, Etienne Sicard
    Pages 189-309
  7. Sonia Ben Dhia, Mohamed Ramdani, Etienne Sicard
    Pages 311-394
  8. Sonia Ben Dhia, Mohamed Ramdani, Etienne Sicard
    Pages 395-429
  9. Back Matter
    Pages 431-473

About this book

Introduction

Electromagnetic Compatibility of Integrated Circuits: Techniques for Low Emission and Susceptibility focuses on the electromagnetic compatibility of integrated circuits. The basic concepts, theory, and an extensive historical review of integrated circuit emission and susceptibility are provided. Standardized measurement methods are detailed through various case studies. EMC models for the core, I/Os, supply network, and packaging are described with applications to conducted switching noise, signal integrity, near-field and radiated noise. Case studies from different companies and research laboratories are presented with in-depth descriptions of the ICs, test set-ups, and comparisons between measurements and simulations. Specific guidelines for achieving low emission and susceptibility derived from the experience of EMC experts are presented.

Keywords

Automotive Computer Aided Design EMC Microelectronics Standard electromagnetic compatibility integrated circuit modeling simulation tables

Editors and affiliations

  • Sonia Ben Dhia
    • 1
  • Mohamed Ramdani
    • 2
  • Etienne Sicard
    • 1
  1. 1.INSA-LESIAToulouseFrance
  2. 2.ESEOAngersFrance

Bibliographic information

  • DOI https://doi.org/10.1007/b137864
  • Copyright Information Springer-Verlag US 2006
  • Publisher Name Springer, Boston, MA
  • eBook Packages Engineering
  • Print ISBN 978-0-387-26600-8
  • Online ISBN 978-0-387-26601-5
  • Buy this book on publisher's site
Industry Sectors
Automotive
Finance, Business & Banking
Electronics
Telecommunications
Aerospace
Oil, Gas & Geosciences
Engineering