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Table of contents (8 chapters)
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Front Matter
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Back Matter
Keywords
About this book
Part I, The Building Blocks, discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires (including power analysis, temperature-dependent device modeling, thermal/electrothermal simulation, and experimental setup-calibration).
Part II, The Applications, discusses three important applications of VLSI electrothermal analysis including temperature-dependent electromigration diagnosis, cell-level thermal placement and temperature-driven power and timing analysis.
Electrothermal Analysis of VLSI Systems will be useful for researchers in the fields of IC reliability analysis and physical design, as well as VLSI designers and graduate students.
Reviews
`Continuing increases in the levels of circuit integration and concomitant increases in performance are sustaining the trend of increasing power dissipation in VLSI systems. A consequence is that the impact of temperature on the successful operation and reliability of devices must be comprehended during the design process.....This text provides a comprehensive formulation of the electrothermal analysis problem beginning with a summary of the sources of power dissipation in CMOS circuits and followed by a formulation of the effect of temperature on MOS devices.'
Dr. Ralph K. Cavin, Vice President, Semiconductor Research Corporation
Authors and Affiliations
Bibliographic Information
Book Title: Electrothermal Analysis of VLSI Systems
Authors: Yi-Kan Cheng, Ching-Han Tsai, Chin-Chi Teng, Sung-Mo Steve Kang
DOI: https://doi.org/10.1007/b117332
Publisher: Springer New York, NY
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eBook Packages: Springer Book Archive
Copyright Information: Springer Science+Business Media New York 2002
Hardcover ISBN: 978-0-7923-7861-7Published: 30 June 2000
Softcover ISBN: 978-1-4757-7373-6Published: 20 April 2013
eBook ISBN: 978-0-306-47024-0Published: 01 December 2005
Edition Number: 1
Number of Pages: XXIII, 210
Number of Illustrations: 36 b/w illustrations
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