Electrothermal Analysis of VLSI Systems

  • Yi-Kan Cheng
  • Ching-Han Tsai
  • Chin-Chi Teng
  • Sung-Mo Steve Kang

Table of contents

  1. Front Matter
    Pages i-xxi
  2. The Building Blocks

  3. The Applications

  4. Back Matter
    Pages 203-210

About this book

Introduction

Electrothermal Analysis of VLSI Systems addresses electrothermal problems in modern VLSI systems.
Part I, The Building Blocks, discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires (including power analysis, temperature-dependent device modeling, thermal/electrothermal simulation, and experimental setup-calibration).
Part II, The Applications, discusses three important applications of VLSI electrothermal analysis including temperature-dependent electromigration diagnosis, cell-level thermal placement and temperature-driven power and timing analysis.
Electrothermal Analysis of VLSI Systems will be useful for researchers in the fields of IC reliability analysis and physical design, as well as VLSI designers and graduate students.

Keywords

CMOS VLSI calculus diagnosis integrated circuit modeling simulation tables

Authors and affiliations

  • Yi-Kan Cheng
    • 1
  • Ching-Han Tsai
    • 2
  • Chin-Chi Teng
    • 3
  • Sung-Mo Steve Kang
    • 2
  1. 1.Motorola, Inc.USA
  2. 2.University of Illinois at Urbana-ChampaignUSA
  3. 3.Silicon Perspective CorporationUSA

Bibliographic information

  • DOI https://doi.org/10.1007/b117332
  • Copyright Information Kluwer Academic Publishers 2002
  • Publisher Name Springer, Boston, MA
  • eBook Packages Springer Book Archive
  • Print ISBN 978-0-7923-7861-7
  • Online ISBN 978-0-306-47024-0
  • About this book
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