Advanced Wirebond Interconnection Technology

  • Shankara K. Prasad

Table of contents

  1. Front Matter
    Pages i-xxix
  2. Pages 1-16
  3. Pages 95-162
  4. Pages 163-480
  5. Pages 481-557
  6. Pages 559-628
  7. Back Matter
    Pages 655-669

About this book


Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as: designing a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor; but the book also explains why to do it that way.


interconnect manufacturing material metal metrics production testing

Authors and affiliations

  • Shankara K. Prasad
    • 1
  1. 1.INKROMABangaloreIndia

Bibliographic information

Industry Sectors
Materials & Steel
Chemical Manufacturing
Consumer Packaged Goods
Energy, Utilities & Environment
Oil, Gas & Geosciences