Advanced Wirebond Interconnection Technology

  • Shankara K. Prasad

Table of contents

  1. Front Matter
    Pages i-xxix
  2. Pages 1-16
  3. Pages 95-162
  4. Pages 163-480
  5. Pages 481-557
  6. Pages 559-628
  7. Back Matter
    Pages 655-669

About this book

Introduction

Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as: designing a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor; but the book also explains why to do it that way.

Keywords

interconnect manufacturing material metal metrics production testing

Authors and affiliations

  • Shankara K. Prasad
    • 1
  1. 1.INKROMABangaloreIndia

Bibliographic information

  • DOI https://doi.org/10.1007/b105273
  • Copyright Information Kluwer Academic Publishers 2004
  • Publisher Name Springer, Boston, MA
  • eBook Packages Springer Book Archive
  • Print ISBN 978-1-4020-7762-3
  • Online ISBN 978-1-4020-7763-0
  • About this book
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