Table of contents

  1. Front Matter
  2. Mikhail J. Atallah, Michael T. Goodrich, S. Rao Kosaraju
    Pages 1-10
  3. Vijaya Ramachandran, Uzi Vishkin
    Pages 33-42
  4. Phillip B. Gibbons, Gary L. Miller, Richard M. Karp, Danny Soroker
    Pages 43-52
  5. Oscar H. Ibarra, Tao Jiang, Bala Ravikumar, Jik H. Chang
    Pages 64-73
  6. Bruce E. Litow, George I. Davida
    Pages 74-80
  7. Richard J. Anderson, Gary L. Miller
    Pages 81-90
  8. Richard J. Anderson, Ashfaq A. Munshi, Barbara Simons
    Pages 124-133
  9. Foto Afrati, Christos H. Papadimitriou, George Papageorgiou
    Pages 134-138
  10. Donald Fussell, Ramakrishna Thurimella
    Pages 149-159
  11. Burkhard Monien, I. Hal Sudborough
    Pages 170-180
  12. John A. Ellis
    Pages 181-190

About these proceedings

Introduction

From the Foreword: "The papers in this volume were presented at the Aegean Workshop on Computing: VLSI Algorithms and Architectures (AWOC 88), organized by the Computer Technology Institute in Patras in cooperation with ACM, EATCS, IEEE and the General Secretariat of Research and Technology (Ministry of Industry, Energy & technology of Greece). They were selected from 119 abstracts submitted in response to the program committee's call for papers and to additional invitations from John Reif. AWOC 88 took place in Corfu, Greece, June 28-July 1, 1988. AWOC 88 is the third meeting in the International Workshop on Parallel Computing & VLSI series; the first meeting took place in Amalfi, Italy, 1984, and the second at Loutraki, Greece, 1986."

Keywords

VLSI communication complexity interconnect logic simulation

Bibliographic information

  • DOI https://doi.org/10.1007/BFb0040367
  • Copyright Information Springer-Verlag 1988
  • Publisher Name Springer, New York, NY
  • eBook Packages Springer Book Archive
  • Print ISBN 978-0-387-96818-6
  • Online ISBN 978-0-387-34770-7
  • Series Print ISSN 0302-9743
  • Series Online ISSN 1611-3349
  • About this book
Industry Sectors
Pharma
Automotive
Chemical Manufacturing
Biotechnology
Electronics
Telecommunications
Consumer Packaged Goods
Aerospace
Oil, Gas & Geosciences