Metamaterial Surface Plasmon-Based Transmission Lines and Antennas

  • Amin┬áKianinejad

Part of the Springer Theses book series (Springer Theses)

Table of contents

  1. Front Matter
    Pages i-xxv
  2. Amin Kianinejad
    Pages 1-9
  3. Amin Kianinejad
    Pages 29-46
  4. Amin Kianinejad
    Pages 73-75
  5. Back Matter
    Pages 77-83

About this book

Introduction

This thesis proposes a reliable and repeatable method for implementing Spoof Surface Plasmon (SSP) modes in the design of various circuit components. It also presents the first equivalent circuit model for plasmonic structures, which serves as an insightful guide to designing SSP-based circuits. Today, electronic circuits and systems are developing rapidly and becoming an indispensable part of our daily life; however the issue of compactness in integrated circuits remains a formidable challenge. Recently, the Spoof Surface Plasmon (SSP) modes have been proposed as a novel platform for highly compact electronic circuits. Despite extensive research efforts in this area, there is still an urgent need for a systematic design method for plasmonic circuits. In this thesis, different SSP-based transmission lines, antenna feeding networks and antennas are designed and experimentally evaluated. With their high field confinement, the SSPs do not suffer from the compactness limitations of traditional circuits and are capable of providing an alternative platform for the future generation of electronic circuits and electromagnetic systems.

Keywords

Microwave Circuits Spoof Surface Plasmon (SSP) Single-Layered Leaky-Wave Antenna (SL-LWA) Dielectric Resonator Antennas (DRA) Slow Wave Transmission-Lines (SW-TL) Spoof Surface Plasmon Circuit Component Design Plasmonic Structures Spoof Surface Plasmon Cells Spoof Surface Plasmon Transmission Lines Spoof Surface Plasmon Antenna Design

Authors and affiliations

  • Amin┬áKianinejad
    • 1
  1. 1.Department of Electrical and Computer EngineeringNational University of SingaporeSingaporeSingapore

Bibliographic information

  • DOI https://doi.org/10.1007/978-981-10-8375-4
  • Copyright Information Springer Nature Singapore Pte Ltd. 2018
  • Publisher Name Springer, Singapore
  • eBook Packages Engineering
  • Print ISBN 978-981-10-8374-7
  • Online ISBN 978-981-10-8375-4
  • Series Print ISSN 2190-5053
  • Series Online ISSN 2190-5061
  • About this book
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