Probe Suppression in Conformal Phased Array

  • Hema Singh
  • Mausumi Dutta
  • P. S. Neethu

Part of the SpringerBriefs in Electrical and Computer Engineering book series (BRIEFSELECTRIC)

Also part of the SpringerBriefs in Computational Electromagnetics book sub series (BRIEFSCE)

Table of contents

  1. Front Matter
    Pages i-xxv
  2. Hema Singh, Mausumi Dutta, P.S. Neethu
    Pages 1-42
  3. Back Matter
    Pages 43-43

About this book


This book considers a cylindrical phased array with microstrip patch antenna elements and half-wavelength dipole antenna elements. The effect of platform and mutual coupling effect is included in the analysis. The non-planar geometry is tackled by using Euler's transformation towards the calculation of array manifold. Results are presented for both conducting and dielectric cylinder. The optimal weights obtained are used to generate adapted pattern according to a given signal scenario. It is shown that array along with adaptive algorithm is able to cater to an arbitrary signal environment even when the platform effect and mutual coupling is taken into account. This book provides a step-by-step approach for analyzing the probe suppression in non-planar geometry. Its detailed illustrations and analysis will be a useful text for graduate and research students, scientists and engineers working in the area of phased arrays, low-observables and stealth technology.


Conformal array of antennas Probe suppression Modified Improved LMS Algorithm Adapted Pattern Mutual Coupling

Authors and affiliations

  • Hema Singh
    • 1
  • Mausumi Dutta
    • 2
  • P. S. Neethu
    • 3
  1. 1.Centre for Electromagnetics (CEM)CSIR - National Aerospace Laboratories Centre for Electromagnetics (CEM)BangaloreIndia
  2. 2.Centre for ElectromagneticsCSIR-National Aerospace Laboratories Centre for ElectromagneticsBangaloreIndia
  3. 3.Centre for ElectromagneticsCSIR - National Aerospace Laboratories Centre for ElectromagneticsBangaloreIndia

Bibliographic information

  • DOI
  • Copyright Information The Author(s) 2017
  • Publisher Name Springer, Singapore
  • eBook Packages Engineering
  • Print ISBN 978-981-10-2271-5
  • Online ISBN 978-981-10-2272-2
  • Series Print ISSN 2191-8112
  • Series Online ISSN 2191-8120
  • Buy this book on publisher's site
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