High-level Estimation and Exploration of Reliability for Multi-Processor System-on-Chip

  • Zheng Wang
  • Anupam Chattopadhyay

Part of the Computer Architecture and Design Methodologies book series (CADM)

Table of contents

  1. Front Matter
    Pages i-xx
  2. Zheng Wang, Anupam Chattopadhyay
    Pages 1-4
  3. Zheng Wang, Anupam Chattopadhyay
    Pages 5-10
  4. Zheng Wang, Anupam Chattopadhyay
    Pages 11-28
  5. Zheng Wang, Anupam Chattopadhyay
    Pages 29-80
  6. Zheng Wang, Anupam Chattopadhyay
    Pages 81-117
  7. Zheng Wang, Anupam Chattopadhyay
    Pages 119-153
  8. Zheng Wang, Anupam Chattopadhyay
    Pages 155-176
  9. Zheng Wang, Anupam Chattopadhyay
    Pages 177-179
  10. Back Matter
    Pages 181-197

About this book

Introduction

This book introduces a novel framework for accurately modeling the errors in nanoscale CMOS technology and developing a smooth tool flow at high-level design abstractions to estimate and mitigate the effects of errors. The book presents novel techniques for high-level fault simulation and reliability estimation as well as architecture-level and system-level fault tolerant designs. It also presents a survey of state-of-the-art problems and solutions, offering insights into reliability issues in digital design and their cross-layer countermeasures. 

Keywords

Architectural Reliability Estimation System- Level Reliability Exploration Architectural Fault Tolerance Processor Design Asymmetric Reliability System-Level Design Probabilistic Error Masking Matrix (PeMM) Node Fault Tolerance (NFT) Reliability Task Mapping Statistical Error Confinement

Authors and affiliations

  • Zheng Wang
    • 1
  • Anupam Chattopadhyay
    • 2
  1. 1.Shenzhen Institutes of Advanced TechnologyChinese Academy of SciencesShenzhenChina
  2. 2.School of Computer Science and EngineeringNanyang Technological UniversitySingaporeSingapore

Bibliographic information

  • DOI https://doi.org/10.1007/978-981-10-1073-6
  • Copyright Information Springer Science+Business Media Singapore 2018
  • Publisher Name Springer, Singapore
  • eBook Packages Engineering
  • Print ISBN 978-981-10-1072-9
  • Online ISBN 978-981-10-1073-6
  • Series Print ISSN 2367-3478
  • Series Online ISSN 2367-3486
  • About this book
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