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Crosstalk in Modern On-Chip Interconnects

A FDTD Approach

  • B.K. Kaushik
  • V. Ramesh Kumar
  • Amalendu Patnaik

Part of the SpringerBriefs in Applied Sciences and Technology book series (BRIEFSAPPLSCIENCES)

Table of contents

  1. Front Matter
    Pages i-xv
  2. Brajesh Kumar Kaushik, V. Ramesh Kumar, Amalendu Patnaik
    Pages 1-9
  3. Brajesh Kumar Kaushik, V. Ramesh Kumar, Amalendu Patnaik
    Pages 11-41
  4. Brajesh Kumar Kaushik, V. Ramesh Kumar, Amalendu Patnaik
    Pages 43-59
  5. Brajesh Kumar Kaushik, V. Ramesh Kumar, Amalendu Patnaik
    Pages 61-79
  6. Brajesh Kumar Kaushik, V. Ramesh Kumar, Amalendu Patnaik
    Pages 81-96
  7. Brajesh Kumar Kaushik, V. Ramesh Kumar, Amalendu Patnaik
    Pages 97-116

About this book

Introduction

The book provides accurate FDTD models for on-chip interconnects, covering most recent advancements in materials and design. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for CNT and GNR based interconnects are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR-based interconnects are also discussed in the book. The proposed models are validated with the HSPICE simulations.

The book introduces the current research scenario in the modeling of on-chip interconnects. It presents the structure, properties, and characteristics of graphene based on-chip interconnects and the FDTD modeling of Cu based on-chip interconnects. The model considers the non-linear effects of CMOS driver as well as the transmission line effects of interconnect line that includes coupling capacitance and mutual inductance effects. In a more realistic manner, the proposed model includes the effect of width-dependent MFP of the MLGNR while taking into account the edge roughness.

Keywords

On-chip Interconnects Carbon Nanotubes Graphene Nanoribbon FDTD Signal Integrity MWCNT Interconnects

Authors and affiliations

  • B.K. Kaushik
    • 1
  • V. Ramesh Kumar
    • 2
  • Amalendu Patnaik
    • 3
  1. 1.Electronics & Communication EngineeringIndian Institute of Technology RoorkeeRoorkeeIndia
  2. 2.Electronics and Communication Engg.Indian Institute of Technology RoorkeeRoorkeeIndia
  3. 3.Electronics and Communication Engg.Indian Institute of Technology RoorkeeRoorkeeIndia

Bibliographic information

  • DOI https://doi.org/10.1007/978-981-10-0800-9
  • Copyright Information The Author(s) 2016
  • Publisher Name Springer, Singapore
  • eBook Packages Engineering
  • Print ISBN 978-981-10-0799-6
  • Online ISBN 978-981-10-0800-9
  • Series Print ISSN 2191-530X
  • Series Online ISSN 2191-5318
  • Buy this book on publisher's site
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