About this book
Future robots are expected to work closely and interact safely with real-world objects and humans alike. Sense of touch is important in this context, as it helps estimate properties such as shape, texture, hardness, material type and many more; provides action related information, such as slip detection; and helps carrying out actions such as rolling an object between fingers without dropping it. This book presents an in-depth description of the solutions available for gathering tactile data, obtaining aforementioned tactile information from the data and effectively using the same in various robotic tasks. Better integration of tactile sensors on a robot’s body is prerequisite for the effective utilization of tactile data. For this reason, the hardware, software and application related issues (and resulting trade-offs) that must be considered to make tactile sensing an effective component of robotic platforms are discussed in-depth.To this end, human touch sensing has also been explored. The design hints coming out of the investigations into human sense of touch can be useful in improving the effectiveness of tactile sensory modality in robotics and other machines.
The concept of semiconductor devices based sensors or solid-state sensorss is an interesting one, as it allows compact and fast tactile sensing systems with capabilities such as human-like spatio-temporal resolution. This book presents a comprehensive description of semiconductor devices based tactile sensing. In particular, novel Piezo Oxide Semiconductor Field Effect Transistor (POSFET) based approach for high resolution tactile sensing has been discussed in detail. Finally, the extension of semiconductors devices based sensors concept to large and flexile areas has been discussed for obtaining robotic or electronic skin. With its multidisciplinary scope, this book is suitable for graduate students and researchers coming from diverse areas such robotics (bio-robots, humanoids, rehabilitation etc.), applied materials, humans touch sensing, electronics, microsystems, and instrumentation. To better explain the concepts the text is supported by large number of figures.
- DOI https://doi.org/10.1007/978-94-007-0579-1
- Copyright Information Springer Science+Business Media Dordrecht 2013
- Publisher Name Springer, Dordrecht
- eBook Packages Engineering
- Print ISBN 978-94-007-0578-4
- Online ISBN 978-94-007-0579-1
- About this book