Efficient Test Methodologies for High-Speed Serial Links

  • Dongwoo Hong
  • Kwang-Ting Cheng

Part of the Lecture Notes in Electrical Engineering book series (LNEE, volume 51)

Table of contents

  1. Front Matter
    Pages i-xi
  2. Dongwoo Hong, Kwang-Ting Cheng
    Pages 1-5
  3. Dongwoo Hong, Kwang-Ting Cheng
    Pages 7-18
  4. Dongwoo Hong, Kwang-Ting Cheng
    Pages 19-40
  5. Dongwoo Hong, Kwang-Ting Cheng
    Pages 41-51
  6. Dongwoo Hong, Kwang-Ting Cheng
    Pages 53-64
  7. Dongwoo Hong, Kwang-Ting Cheng
    Pages 65-73
  8. Dongwoo Hong, Kwang-Ting Cheng
    Pages 75-87
  9. Dongwoo Hong, Kwang-Ting Cheng
    Pages 89-90
  10. Back Matter
    Pages 91-98

About this book

Introduction

With the increasing demand for higher data bandwidth, communication systems’ data rates have reached the multi-gigahertz range and even beyond. Advances in semiconductor technologies have accelerated the adoption of high-speed serial interfaces, such as PCI-Express, Serial-ATA, and XAUI, in order to mitigate the high pin-count and the data-channel skewing problems. However, with the increasing number of I/O pins and greater data rates, significant challenges arise for testing high-speed interfaces in terms of test cost and quality, especially in high volume manufacturing (HVM) environments. Efficient Test Methodologies for High-Speed Serial Links describes in detail several new and promising techniques for cost-effectively testing high-speed interfaces with a high test coverage. One primary focus of Efficient Test Methodologies for High-Speed Serial Links is on efficient testing methods for jitter and bit-error-rate (BER), which are widely used for quantifying the quality of a communication system. Various analysis as well as experimental results are presented to demonstrate the validity of the presented techniques.

Keywords

BER Estimation Clock and Data Recovery (CDR) Design-for-Test (DFT) Hardware High Speed IO Test Integrated Circuits Interface Jitter Measurement

Authors and affiliations

  • Dongwoo Hong
    • 1
  • Kwang-Ting Cheng
    • 2
  1. 1.Broadcom CorporationIrvineU.S.A.
  2. 2.College of EngineeringUniversity of California, Santa BarbaraSanta BarbaraU.S.A.

Bibliographic information

  • DOI https://doi.org/10.1007/978-90-481-3443-4
  • Copyright Information Springer Science+Business Media B.V. 2010
  • Publisher Name Springer, Dordrecht
  • eBook Packages Engineering
  • Print ISBN 978-90-481-3442-7
  • Online ISBN 978-90-481-3443-4
  • Series Print ISSN 1876-1100
  • Series Online ISSN 1876-1119
  • About this book
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