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Carbon Nanotube Based VLSI Interconnects

Analysis and Design

  • Brajesh Kumar Kaushik
  • Manoj Kumar Majumder

Part of the SpringerBriefs in Applied Sciences and Technology book series (BRIEFSAPPLSCIENCES)

Table of contents

  1. Front Matter
    Pages i-xi
  2. Brajesh Kumar Kaushik, Manoj Kumar Majumder
    Pages 1-15
  3. Brajesh Kumar Kaushik, Manoj Kumar Majumder
    Pages 17-37
  4. Brajesh Kumar Kaushik, Manoj Kumar Majumder
    Pages 39-56
  5. Brajesh Kumar Kaushik, Manoj Kumar Majumder
    Pages 57-68
  6. Brajesh Kumar Kaushik, Manoj Kumar Majumder
    Pages 69-77
  7. Back Matter
    Pages 79-86

About this book

Introduction

The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models.

Keywords

Carbon Nanotube Delay and Signal Integrity Mixed Carbon Nanotube Bundle Modeling Types of Interconnects VLSI Design

Authors and affiliations

  • Brajesh Kumar Kaushik
    • 1
  • Manoj Kumar Majumder
    • 2
  1. 1.Electronics and Communication EnggIndian Institute of Technology RoorkeeRoorkeeIndia
  2. 2.Department of Electronics & Communication EngineeringIndian Institute of Technology RoorkeeRoorkeeIndia

Bibliographic information

  • DOI https://doi.org/10.1007/978-81-322-2047-3
  • Copyright Information The Author(s) 2015
  • Publisher Name Springer, New Delhi
  • eBook Packages Engineering
  • Print ISBN 978-81-322-2046-6
  • Online ISBN 978-81-322-2047-3
  • Series Print ISSN 2191-530X
  • Series Online ISSN 2191-5318
  • Buy this book on publisher's site
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