Authors:
- First book dedicated to the modeling of CMP for sub-micron integrated circuit (IC) fabrication
- Modeling and simulation are critical to transfer CMP from an engineering ‘art’ to an engineering ‘science’
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Table of contents (9 chapters)
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Front Matter
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Back Matter
About this book
Authors and Affiliations
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R & D Cypress Semiconductor, San Jose, USA
Jianfeng Luo
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Dept. Mechanical Engineering, University of California at Berkeley, Berkeley, USA
David A. Dornfeld
Bibliographic Information
Book Title: Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication
Book Subtitle: From Particle Scale to Feature, Die and Wafer Scales
Authors: Jianfeng Luo, David A. Dornfeld
DOI: https://doi.org/10.1007/978-3-662-07928-7
Publisher: Springer Berlin, Heidelberg
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eBook Packages: Springer Book Archive
Copyright Information: Springer-Verlag Berlin Heidelberg 2004
Hardcover ISBN: 978-3-540-22369-6Published: 07 October 2004
Softcover ISBN: 978-3-642-06115-8Published: 15 December 2010
eBook ISBN: 978-3-662-07928-7Published: 09 March 2013
Edition Number: 1
Number of Pages: XXIV, 311
Topics: Industrial Chemistry/Chemical Engineering, Surface and Interface Science, Thin Films, Circuits and Systems, Electronics and Microelectronics, Instrumentation, Surfaces and Interfaces, Thin Films, Physical Chemistry
Industry Sectors: Aerospace, Biotechnology, Chemical Manufacturing, Consumer Packaged Goods, Engineering, Materials & Steel, Oil, Gas & Geosciences, Pharma