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Low Power Active Electrode ICs for Wearable EEG Acquisition

  • Jiawei Xu
  • Refet Firat Yazicioglu
  • Chris Van Hoof
  • Kofi Makinwa

Part of the Analog Circuits and Signal Processing book series (ACSP)

Table of contents

  1. Front Matter
    Pages i-xiii
  2. Jiawei Xu, Refet Firat Yazicioglu, Chris Van Hoof, Kofi Makinwa
    Pages 1-10
  3. Jiawei Xu, Refet Firat Yazicioglu, Chris Van Hoof, Kofi Makinwa
    Pages 11-21
  4. Jiawei Xu, Refet Firat Yazicioglu, Chris Van Hoof, Kofi Makinwa
    Pages 23-47
  5. Jiawei Xu, Refet Firat Yazicioglu, Chris Van Hoof, Kofi Makinwa
    Pages 49-68
  6. Jiawei Xu, Refet Firat Yazicioglu, Chris Van Hoof, Kofi Makinwa
    Pages 69-92
  7. Jiawei Xu, Refet Firat Yazicioglu, Chris Van Hoof, Kofi Makinwa
    Pages 93-114
  8. Jiawei Xu, Refet Firat Yazicioglu, Chris Van Hoof, Kofi Makinwa
    Pages 115-118
  9. Back Matter
    Pages 119-125

About this book

Introduction

This book presents fundamental requirements, electrical specification, and parameter tradeoffs of wearable EEG acquisition circuits, especially those compatible with dry electrodes for user-friendly recordings.  The authors introduce active electrode, the most promising solution for dry electrodes-based EEG measurement. This architectural concept has been combined with various, innovative circuit design techniques to illustrate structured IC design methodologies for high performance EEG recording. This book also gives examples on the design, implementation and evaluation of three generations of active electrode ICs.

Keywords

Bio-Medical CMOS ICs Biopotential Readout Circuits Ultra Low-Power Integrated Circuit Design IC Design for Wireless Neural Interfaces Chopper Amplifiers

Authors and affiliations

  • Jiawei Xu
    • 1
  • Refet Firat Yazicioglu
    • 2
  • Chris Van Hoof
    • 3
  • Kofi Makinwa
    • 4
  1. 1.Holst Centre / imecEindhovenThe Netherlands
  2. 2.Galvani BioelectronicsStevenageUnited Kingdom
  3. 3.ESAT-MICASKU Leuven / imecLeuvenBelgium
  4. 4.Delft University of TechnologyDelftThe Netherlands

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-319-74863-4
  • Copyright Information Springer International Publishing AG 2018
  • Publisher Name Springer, Cham
  • eBook Packages Engineering
  • Print ISBN 978-3-319-74862-7
  • Online ISBN 978-3-319-74863-4
  • Series Print ISSN 1872-082X
  • Series Online ISSN 2197-1854
  • Buy this book on publisher's site
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