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Outlook and Challenges of Nano Devices, Sensors, and MEMS

  • Ting Li
  • Ziv  Liu

Table of contents

  1. Front Matter
    Pages i-xvi
  2. MOS

    1. Front Matter
      Pages 1-1
    2. Zhang Jun-an, Li Guangjun, Zhang Rui-tao, Yang Yu-jun, Li Xi, Yan Bo et al.
      Pages 45-68
    3. Wanling Deng, Jielin Fang, Xixiong Wei, Fei Yu
      Pages 69-98
    4. Jibin Zou, Shaofeng Guo, Ru Huang, Runsheng Wang
      Pages 99-122
    5. Shengkai Wang, Honggang Liu
      Pages 123-149
    6. Jizhi Liu, Zhiwei Liu, Fei Hou, Hui Cheng, Liu Zhao, Rui Tian
      Pages 151-181
    7. Xinnan Lin, Haijun Lou, Ying Xiao, Wenbo Wan, Lining Zhang, Mansun Chan
      Pages 183-236
  3. Sensor

    1. Front Matter
      Pages 237-237
    2. Kai Tao, Jin Wu, Ajay Giri Prakash Kottapalli, Sun Woh Lye, Jianmin Miao
      Pages 271-297
    3. Ting Li, Zebin Li, Jinhao Zhou, Boan Pan, Xiao Xiao, Zhaojia Guo et al.
      Pages 299-329
    4. Zakriya Mohammed, Waqas Amin Gill, Mahmoud Rasras
      Pages 331-345
    5. Jin Wu, Kai Tao, Jianmin Miao, Leslie K. Norford
      Pages 347-363
    6. Shuanghong Wu, Han Zhou, Mengmeng Hao, Zhi Chen
      Pages 365-393
  4. Nanostructured Oxide

  5. Other Nanoscale Devices

    1. Front Matter
      Pages 457-457
    2. Li Li, Chengjun Huang, Haiying Zhang
      Pages 459-482

About this book

Introduction

This book provides readers with an overview of the design, fabrication, simulation, and reliability of nanoscale semiconductor devices, MEMS, and sensors, as they serve for realizing the next-generation internet of things. The authors focus on how the nanoscale structures interact with the electrical and/or optical performance, how to find optimal solutions to achieve the best outcome, how these apparatus can be designed via models and simulations, how to improve reliability, and what are the possible challenges and roadblocks moving forward.

Keywords

FinFET devices Nanoscale MEMS Nanoscale MOS devices Nanoscale semiconductor devices Nanoscale sensors

Editors and affiliations

  • Ting Li
    • 1
  • Ziv  Liu
    • 2
  1. 1.State Key Lab of Electronic Thin Film & Integrated DeviceUniversity of Electronic Science & Technology of ChinaChengduChina
  2. 2.Microelectronics & Solid-state Electronics CollegeUniversity of Electronic Science & Technology of ChinaChengduChina

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-319-50824-5
  • Copyright Information Springer International Publishing AG 2017
  • Publisher Name Springer, Cham
  • eBook Packages Engineering
  • Print ISBN 978-3-319-50822-1
  • Online ISBN 978-3-319-50824-5
  • Buy this book on publisher's site
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