About this book
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.
•Provides single-source reference to the latest research in 3D optoelectronic integration: process, devices, and systems;
•Explains the use of wireless 3D integration to improve 3D IC reliability and yield;•Describes techniques for monitoring and mitigating thermal behavior in 3D ICs;
•Includes discussion of 3D integration of high-density power sources and novel NVM.
3D Heterogeneous Integration 3D Integrated Circuits 3D Optoelectronic Integration 3D Process Development TSV Modeling and Circuit Techniques Thermal Management of 3D ICs Three-dimensional Integrated Circuit Design
Editors and affiliations
- DOI https://doi.org/10.1007/978-3-319-20481-9
- Copyright Information Springer International Publishing Switzerland 2016
- Publisher Name Springer, Cham
- eBook Packages Engineering
- Print ISBN 978-3-319-20480-2
- Online ISBN 978-3-319-20481-9
- About this book